CNC Routing Rigid Flexible PCB PCBA Fabrication Stencil Making
OEM/ODM/EMS Services For PCBA:
• PCBA, PCB Board assembly: SMT & PTH & BGA
• PCBA and enclosure design
• Components sourcing and purchasing
• Quick prototyping
• Plastic injection molding
• Metal sheet stamping
• Final assembly
• Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
• Custom clearance for material importing and product exporting
• PCBA reproduction
Rigid Flexible PCB Capability
| | |
| product type | FR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB |
| Max layer count | 20 layers |
| Min base copper thickness | 1/3 OZ (12um) |
| Max finished copper thickness | 10 OZ (350um) |
| Min trace width/spacing(Inner layer) | 2/2mil (0.05mm) |
| Min trace width/spacing(Outer layer) | 2/2mil (0.05mm) |
| Min spacing between hole to inner layer conductor | 6mil (0.15mm) |
| Min spacing between hole to outer layer conductor | 6mil (0.15mm) |
| Min annular ring for via | 4mil (0.1mm) |
| Min annular ring for component hole | 4mil (0.1mm) |
| Min BGA diameter | 4mil (0.1mm) |
| Min BGA pitch | 4mil (0.1mm) |
| Min hole size | 0.15mm(CNC); 0.1mm(Laser) |
| Max aspect ratios | 8.01 |
| Min soldermask bridge width | 4mil (0.1mm) |
| Soldermask/circuit processing method | Film |
| Min thickness for insulating layer | 1mil (0.025mm) |
| HDI & special type PCB | HDI(1-3 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-14 layers), Buried capacitance & resistance, 0.14mm to 0.2mm extra thinner pcb,high heat conducting thermoelectric separation copper based pcb, etc |
| Surface treatment type | ENIG, HAL, HAL lead free, OSP, Immersion Sn, mmersion silver, Plating hard gold,Plating silver, carbon oil, ENIG immersion tin plating |
| Max PCB size | Multi-layer: 600*550mm 1-2 layer: 500*1200MM |
Rigid flex printed circuit board (PCB) is a hybrid c