Flip Chip COB Outdoor HF4027JP15H Bridgelux chip 30V 50W 80W 100W

• Efficacy of 130 lm/W typical for 3000K, 80CRI

• Compact high flux density light source

• Uniform, high quality illumination

• Minimum 70, 80, and 90 CRI options

• StreaCLined thermal path

• ENERGY STAR® / ANSI compliant color binning structure with 2, 3 and 5 SDCM standard

• More energy efficient than incandescent, halogen and fluorescent lamps

• High voltage or Low voltage DC operation

• Product series and company logo on the front

• RoHS compliant

The part number designation for TYF ML Series LED arrays is explained as follows:

5.1 Color Binning Information

Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)

CIE1931-x

Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range

6.1 Table 39: Maximum Ratings

Notes for Table 39:

• Driven the arrays at higher currents however lumen maintenance may be reduced.
• Proper current derating must be observed to maintain junction temperature below the maximum
• Pulsed operation with a peak drive current equal to the stated peak pulsed forward current is acceptable if the pulse on-time is ≤1ms per cycle and the duty cycle is ≤10%
• Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. Maximum rating provided for reference only.

7

Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode

RECOMMENDED SOLDERING CONDITION

For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a

temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied

to resin part while soldering is implemented. Next process of soldering should be carried out after the product has

return to ambient temperature. CAUTION: TEMPERATURE CONTROL

Product Packing and Labeling