MachineU > China Products > Construction & Real Estate > Heat Insulation Materials > Other Heat Insulation Materials
Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler
Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler
Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler
Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler
Specifications
Brand Name :
AOK
Model Number :
TF300
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
400ml(200ml each part)
Payment Terms :
T/T
Delivery Time :
13-15 working days
Packaging Details :
50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)
Composition :
Ceramic filler + Silicone
Color :
Light Blue
Density :
3 g/cc
Breakdown Voltage :
≥7.0 kv/mm
Usage Temperature :
-40~150 ℃
Dielectric Constant :
7.0（@10mhz）
Flammability :
V-0
Thermal conductivity :
3.0 W/m.K
Viscosity/Component A :
400000 (cps)
Viscosity/Component B :
400000 (cps)
Hardness, after cure :
40 (shore oo)
Description

Two Part Thermal Gel Materials Liquid Gap Fillers With Light Blue For Control Modules

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Light Bule Visual
Density(g/cc) 3 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 3.0 ASTM D5470
Viscosity/Component A (cps) 400000 ASTM D2196
Viscosity/Component B (cps) 400000 ASTM D2196
Hradness,after cure(shore OO) 40 ASTM D22240

Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

Features & Benefits

1 High thermal conductivity, low thermal resistance, excellent wettability
2 Low pressure to electronic components
3 Manageable raw material stock ,lower composite cost
4 For vehicle electronic products
5 Can fill any uneven gaps
6 Automatic point dispensing available, any thickness or size available
7 High reliability, thermal conductive gel is equal to thermal conductive silicon pad after curing, no volatility.

Typical Applications

1 Communication equipment
2 Power equipment
3 Medical instrument
4 New energy vehicle
5 Filling any gap between friable component and shell

Purchase information
Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)

Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour

Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.

Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

Send your message to this supplier
Send Now

Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

Ask Latest Price
Product Detail
Brand Name :
AOK
Model Number :
TF300
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
400ml(200ml each part)
Payment Terms :
T/T
Contact Supplier
Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler
Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

Shenzhen Aochuan Technology Co., Ltd

Active Member
4 Years
guangdong, shenzhen
Since 2004
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Thermal Conductive Pad, Ultra Soft Thermal Pad, Silicone Free Thermal Pad
Total Annual :
15000000-2000000
Employee Number :
150~300
Certification Level :
Active Member
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products Liquid Gap Filler
MachineU China Products Construction & Real Estate Heat Insulation Materials Other Heat Insulation Materials
Contact Supplier
Submit Requirement