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Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device
Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device
Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device
Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device
Specifications
Brand Name :
AOK
Model Number :
TP800
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
1000pcs
Payment Terms :
T/T
Delivery Time :
13-15 working days
Packaging Details :
400 mm x 200 mm
Product Name :
Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device
Composition :
Ceramic Filler + Silicone
Color :
Pink
Volume Resistivity :
1.0*10^12（Ω.cm）
Flammability :
V-0
Thermal conductivity :
8.0±0.5（W/m.K）
Description

Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ＞6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 1012 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470


Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ＞6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 1012 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470
Product tags

anti-electrostatic mat

,

how to ground an antistatic mat

,

use of anti static mat
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Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

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Product Detail
Brand Name :
AOK
Model Number :
TP800
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
1000pcs
Payment Terms :
T/T
Contact Supplier
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Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device
Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Shenzhen Aochuan Technology Co., Ltd

Active Member
4 Years
guangdong, shenzhen
Since 2004
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Thermal Conductive Pad, Ultra Soft Thermal Pad, Silicone Free Thermal Pad
Total Annual :
15000000-2000000
Employee Number :
150~300
Certification Level :
Active Member
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