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Multiscene Laptop CPU Thermal Pad
Multiscene Laptop CPU Thermal Pad
Multiscene Laptop CPU Thermal Pad
Multiscene Laptop CPU Thermal Pad
Specifications
Brand Name :
AOK
Model Number :
UTP100
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
1000pcs
Payment Terms :
T/T
Delivery Time :
13-15working days
Packaging Details :
400mmx200mm
Product name :
Ultra Soft Thermal Pad Ultra Soft Custom Silicon Thermal Pad For Heat Dissipation
Composition :
Ceramic Filler, Silicone, and Reinforced Fiberglass
Color :
White and Brick Red
Thickness :
0.5~12.0 (mm)
Density :
2.5(g/cc)
Hardness :
30±5(Shore OO)
Description

Ultra Soft Thermal Pad Ultra Soft Custom Silicon Thermal Pad For Heat Dissipation

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

Product feature:

■ Thermal Conductivity:1.0 W/m.K
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ because the air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surface, and the thermal silicone sheet can be installed between the heat source and the radiator to squeeze the air out of the contact surface;
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;

Typical applications:
■ Networking and Telecommunications
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ Consumer Electronics: Gaming Systems, and LCDs

Purchase information:

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

Multiscene Laptop CPU Thermal Pad

Product tags

laptop gpu thermal pad

,

thermal pad cpu

,

high performance thermal pad
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Multiscene Laptop CPU Thermal Pad

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Product Detail
Brand Name :
AOK
Model Number :
UTP100
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
1000pcs
Payment Terms :
T/T
Contact Supplier
Multiscene Laptop CPU Thermal Pad
Multiscene Laptop CPU Thermal Pad

Shenzhen Aochuan Technology Co., Ltd

Active Member
4 Years
guangdong, shenzhen
Since 2004
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Thermal Conductive Pad, Ultra Soft Thermal Pad, Silicone Free Thermal Pad
Total Annual :
15000000-2000000
Employee Number :
150~300
Certification Level :
Active Member
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