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Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing
Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing
Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing
Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing
Specifications
Brand Name :
AOK
Model Number :
TM
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
400 ml (200 ml each part)
Payment Terms :
T/T
Delivery Time :
13~15 working days
Packaging Details :
50 ml (25 ml each part)/400 ml (200 ml each part)/ 20 kg (10 kg each part)
Product Name :
Single Part Silicone Thermal Conductive Gap Filler With Room Temperature Curing
Composition :
Ceramic filler + Silicone
Breakdown Voltage :
≥5.0 kv/mm
Dielectric Constant :
7.3（@10mhz）
Flammability :
V-0
Thermal conductivity :
3.0 W/m.K
Description

Single Part Silicone Thermal Conductive Gap Filler With Room Temperature Curing

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color Green Visual
Density(g/cc) 2.9 ASTM D792
Extrudability(g/s) 5.0 ISO9048
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ≥5.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 3.0 ASTM D5470

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.K
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

Purchasing information
Packing specification: 300 ml Cartridge/1Kg Jar/20 Kg Pail

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Product tags

thermally conductive filler

,

heat resistant gap filler

,

thermal conductive epoxy
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Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

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Product Detail
Brand Name :
AOK
Model Number :
TM
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
400 ml (200 ml each part)
Payment Terms :
T/T
Contact Supplier
Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing
Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Shenzhen Aochuan Technology Co., Ltd

Active Member
4 Years
guangdong, shenzhen
Since 2004
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Thermal Conductive Pad, Ultra Soft Thermal Pad, Silicone Free Thermal Pad
Total Annual :
15000000-2000000
Employee Number :
150~300
Certification Level :
Active Member
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