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Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules
Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules
Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules
Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules
Specifications
Brand Name :
AOK
Model Number :
TM300
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
400 ml (200 ml each part)
Payment Terms :
T/T
Delivery Time :
13-15 working days
Packaging Details :
50 ml (25 ml each part)/ 400 ml (200 ml each part)/ 20 kg (10 kg each part)
Product Name :
Silicone Thermal Conductive Gap Filler With Good insulation For LED
Composition :
Ceramic filler + Silicone
Usage Temperature :
-40 ℃ ~ 150 ℃
Thermal Resistance :
0.3 (℃-in2/W)0.1mm@50psi
Dielectric Constant :
7.3（@10mhz）
Thermal conductivity :
3.0 W/m.K
Description
Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color Green Visual
Density(g/cc) 2.9 ASTM D792
Extrudability(g/s) 5.0 ISO9048
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ≥5.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 3.0 ASTM D5470

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.K
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

Purchasing information
Packing specification: 300ml Cartridge/1Kg Jar/20KG Pail

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Product tags

thermal conductive adhesive for led

,

thermal circuit protector

,

solder mask thermal conductivity
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Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

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Product Detail
Brand Name :
AOK
Model Number :
TM300
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
400 ml (200 ml each part)
Payment Terms :
T/T
Contact Supplier
Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules
Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Shenzhen Aochuan Technology Co., Ltd

Active Member
4 Years
guangdong, shenzhen
Since 2004
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Thermal Conductive Pad, Ultra Soft Thermal Pad, Silicone Free Thermal Pad
Total Annual :
15000000-2000000
Employee Number :
150~300
Certification Level :
Active Member
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