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Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler
Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler
Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler
Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler
Specifications
Brand Name :
AOK
Model Number :
TF
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
400ml(200ml each part)
Payment Terms :
T/T
Delivery Time :
13-15 working days
Packaging Details :
50 ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)
Product Name :
3.0W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking
Composition :
Ceramic filler + Silicone
Thermal conductivity :
3.0 W/m.K
Viscosity/Component A :
400000 (cps)
Viscosity/Component B :
400000 (cps)
Hardness, after cure :
40 (shore oo)
Description

3.0W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Light Bule Visual
Density(g/cc) 3 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 3.0 ASTM D5470
Viscosity/Component A (cps) 400000 ASTM D2196
Viscosity/Component B (cps) 400000 ASTM D2196
Hradness,after cure(shore OO) 40 ASTM D22240

Product feature

1. High thermal conductivity, low thermal resistance, excellent wetting
2. Soft, stress-free, infinitely compressed to a minimum of 0.1 mm
3. No settlement, no flow, can fill any uneven gap
4. Convenient design and application, with automatic glue machine can adjust any thickness size

Typical applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays

Purchase information
Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)

Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour

Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.

Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler

Product tags

thermally conductive filler

,

thermal paste thermal conductivity

,

thermal conductivity thermal paste
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Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler

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Product Detail
Brand Name :
AOK
Model Number :
TF
Certification :
RoHS, Reach, UL
Place of Origin :
China
MOQ :
400ml(200ml each part)
Payment Terms :
T/T
Contact Supplier
Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler
Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler

Shenzhen Aochuan Technology Co., Ltd

Active Member
4 Years
guangdong, shenzhen
Since 2004
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Thermal Conductive Pad, Ultra Soft Thermal Pad, Silicone Free Thermal Pad
Total Annual :
15000000-2000000
Employee Number :
150~300
Certification Level :
Active Member
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