40Khz Scattering Ultrasonic Nozzle Atomization Coating Semiconductor Chip Calcium Titanate Solar Cell

Description:

Scattering nozzles use low-pressure air/gas to generate uniform and wide spray patterns, with each nozzle reaching a maximum of 9.8 inches (25 centimeters) depending on the distance from the substrate. The speed of the air flow is controllable to allow low or high impact of the atomized spray on the product or substrate. Using multiple nozzles in series can achieve infinite width. Scattering nozzle design is used for wide patterns with high repeatability in slender nozzles.

The scattering type ultrasonic nozzle is an ultrasonic atomizing nozzle with a cyclone cone spray. It uses the ultrasonic atomization nozzle technology, and through the special vortex flow channel design, the carrier gas is converted into a uniform rotating airflow, so that the ultrasonic atomization of the liquid mist is dispersed in the form of a cyclone spray, expanding the spray area of the atomizer. Ultrasonic nozzles can also be sprayed on vertical or curved surfaces and other substrates with sharp edges.

The typical application of scattering type ultrasonic nozzles is the photoresist coating on semiconductor chips, where the photoresist is sprayed onto the semiconductor chips. Due to the rotational scattering of mist emitted by the scattering type ultrasonic nozzle, a uniform photoresist film can be formed not only on the wafer plane, but also on the sidewalls and corners of the wafer microstructure. In addition, scattering ultrasonic nozzles can also be used for thin film solar cell coatings, calcium titanate solar cell coatings, AR transmission and reflection film coatings, insulation film coatings, superhydrophobic coating coatings, PCB flux coatings, and other applications.

Parameters:

Advantage:

1. High stability: Made of high-performance titanium alloy and stainless steel, it has strong adaptability, corrosion resistance, no pressure, no noise, no nozzle wear and blockage, and high uniformity of atomized particles.
2. Material saving and environmental protection: the impact of spray is very small, which will not cause liquid splashing, thus reducing the waste of raw materials and air pollution caused by back spraying. The material utilization rate of ultrasonic spraying is more than 4 times that of traditional two fluid spraying.
3. High controllability: it can accurately control the atomization flow, low flow continuous spray, and spray shape is easy to control and shape (increase the spray manipulator), which is applicable to the industrial field. By combining, the atomization amount can meet any requirement.
4. Easy maintenance: The liquid is transmitted to the spray head through its own gravity or low-pressure pump and realizes continuous or intermittent atomization. There is no blockage, no wear, no noise, no pressure, and no moving parts. When atomizing, there is no need for cooling water. The energy consumption is small, the equipment is simple, and the failure rate is low. The ultrasonic spray head has the function of cleaning and daily maintenance free.

40Khz Scattering Ultrasonic Nozzle Atomization Coating Semiconductor Chip Calcium Titanate Solar Cell