Smart Cards New Technology for Producing RFID Inlays by 70Khz Ultrasonic Wire Embedding Machine

Brief Introduction:

Ultrasonic smart card welding equipment transmitted ultrasonic energy through welding parts to welding area, local high temperature will happen due to high acoustic resistance between two welding interface places. Also, no enough time dissipating out heating energy timely because of poor plastic thermal conductivity, heating energy gathered in welding area since could not dissipating out timely, the two plastic contact areas will welt rapidly, coupled with a certain pressure, it makes fusion to one unite. When ultrasonic stop function, and keep the pressure sustain to make its solidification molding, finally forming a strong molecular chain, which achieve the purpose of welding. And the welding strength can close to raw material body strength.

Parameters:

Components and Parts

Generator

Booster

Converter

Welding Horn

Protective Sleeve (Nylon and Aluminum optional)

HF Cable

Power Cable

Benefits:

In the production of Bank card, smart card and VIP, which need to dip tin coils and then welding.

ultrasonic welder can welding wire directly, the welding spot has the following benefits:

1. welding spot firm, prevent to cold Weld.

2. same size welding spot, consistency.

3. welding spot small, easy to press fit package.

4. eliminating the need for pre-welded solder dip process,can hire less one operations staff.

5. its welding is faster than iron.

6. the production process will not produce exhaust gas waste pollution.

7. 70KHz ultrasonic unit, speed welding, low production costs.

8. Stable frequency of ultrasonic automatic planting line machine, and could adjust frequency according to customer requirements.

Compare with etching antenna technology:

Ultra-thin IC card is made possible by ultrasonic embedding process.It will effectively solve the problem of the failure of etching antenna technology in the application of ultra-thin IC card, which can reduce the scrap rate and reuse cost.The ultra-thin IC card produced by using the ultrasonic embedding process is the same as the IC card manufactured by the traditional process, so its average service life will be longer than the ultra-thin IC card produced by using the etching antenna (6 years) process. Two different processes, the material difference is mainly in the antenna part, the antenna material used in the etching antenna process is a PET (polyethylene terephthalate, PET) sheet with a thickness of 0.078 mm and a precision etched aluminum wire, and Ultrasound embedding process antenna for enameled copper wire, the same production performance of an IC card, according to the material price of etching antenna price is about 2 times the price of copper, so the use of ultrasonic embedding process to produce ultra-thin IC card The price is also slightly better. The mass production of ultra-thin IC CARDS will have a profound impact on the continuous development of the smart card industry.

Smart Cards New Technology for Producing RFID Inlays by 70Khz Ultrasonic Wire Embedding Machine