Little heat produced Ultrasonic Abrasive Processing For Ceramic or Diamonds Impact Grinding
Description:
Ultrasonic machining is changing the manufacturing industries with its superlative performance. The main reason why this machining process is used in the manufacturing area is because it evolves less heat in the process. All the operations done with the ultrasonic machining method are cost effective and best in results. Ultrasonic machining is an abrasive process which can create any material into hard and brittle form with the help of its vibrating tool and the indirect passage of abrasive particles towards the work piece. It is a low material removal rate machining process.
Ultrasonic impact grinding is an operation that involves a vibrating tool fluctuating the ultrasonic frequencies in order to remove the material from the work piece. The process involves an abrasive slurry that runs between the tool and the work piece. Due to this, the tool and the work piece never interact with each other. The process rarely exceeds two pounds.
Principle:
The time spent on ultrasonic machine entirely depends on the frequency of the vibrating tool. It also depends on the size of grains of the abrasive slurry, the rigidity and the viscosity as well. The grains used in the abrasive fluid are usually boron carbide or silicon carbide as they are rigid than others. The used abrasive can be carried away easily if the viscosity of the slurry fluid is less.
Ultrasonic processing features:
1.It is not limited by the conductivity of materials. It is suitable for punching, cutting, grooving, nesting, engraving, etc. of various hard and brittle materials such as glass, quartz, ceramic, silicon, ferrite, gemstone and jade. Batch deburring of small parts, surface polishing of the mold and dressing of the grinding wheel.
2.The processing precision is high and the surface quality is high. The aperture diameter of ultrasonic drilling is 0.1~90mm, the processing depth can reach more than 100mm, and the precision of the hole can reach 0.02~0.05mm. The surface roughness of the glass treated with W40 boron carbide abrasive can reach 1.25~0.63um, the processed hard alloy can reach 0.63~0.32um, and the processed surface has no structural change, residual stress and burn.
3.The tool has small macroscopic force on the workpiece, small heat influence, can process thin wall, narrow slit and sheet workpiece, and can process various complex cavities and profiles as long as the workpiece is made into corresponding shapes and sizes.
4.Since the scraping of the workpiece material mainly depends on the action of the abrasive, the final hardness should be higher than the hardness of the material to be processed, and the hardness of the tool can be lower than the hardness of the workpiece material.
5.There is no need to make the tool and the workpiece make relatively complicated relative movements. Therefore, the structure of the ultrasonic machining machine is relatively simple, and the operation and maintenance are convenient.
6.Ultrasonic machining can be combined with other traditional or special processing, such as ultrasonic vibration cutting, ultrasonic vibration grinding, ultrasonic electric spark machining and ultrasonic electrolytic composite processing, which can improve the processing and obtain better processing results.
Technical Parameters:
Frequency | 20Khz/40Khz |
Output Power | 500-1000W |
Voltage | 110- 240V |
Speed | 3000 - 10000 r/min |
Power Adjusting | Step or continuous |
Working Time Control | 24 Hours |
Weight | 30 KG |
Application | Ultrasonic Drilling/Milling/Cutting |
Generator | Digital Generator, auto-tuning |
Resonance point amplitude | 10um or more |
Matching tool | mill head Φ2-Φ13; disk cutter Φ50; dilling head Φ2-Φ6 |
Length of cable | or Customized |
Advantages:
- Machined all sorts of hard materials
- Produces fine finished and structured results
- Produces less heat
- Various hole cut shapes due to vibratory motion of the tool
Applications:
Best choice for working with hard materials such as ceramic matrix composites, ruby, piezo-ceramics, glass, ceramics, Quartz, ferrite, diamonds, technical ceramics, alumina, PCD, sapphire, CVD silicon carbide and similar ones.




