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CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor
Specifications
Brand Name :
UNICOMP
Model Number :
CX3000
Certification :
CE, FDA
Place of Origin :
China
MOQ :
1Set
Price :
can negotiate
Payment Terms :
T/T, L/C
Supply Ability :
30 sets per month
Delivery Time :
30 days
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Name :
Electronics X Ray Machine
Tube Voltage :
100KV
Size :
750(L)x570(W)x890(H)mm
X-ray Leakage :
< 1uSv/h
Power Consumption :
0.5kW
Power :
220AC/50Hz
Description

CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor

X ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer.

X ray Inspecting Features:

(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.

(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.

(3) The test preparation time is greatly reduced.

(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.

(5) Double layers board and multi-layer boards only one check (with layered function).

(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.

Item Definition Specs
System Parameters Size 750(L)x570(W)x890(H)mm
Weight 300kg
Power 220AC/50Hz
Power Consumption 0.5kW
X-ray Tube Type Closed
Max.Voltage 100kV
Max.Power 200μA
Spot Size 5μm
Detector Intensifier FPD
X-ray Coverage 48mm x 54mm
Resolution 208Lp/cm
Work Station Max.Loading Size 200mm x 200mm
Max.Inspection Area 200mm x 200mm
Oblique Angle Views 360° rotary fixture (Optional)
X-ray Leakage <1μSv/h


Product tags

x-ray processor

,

siemens digital x ray machine

,

infrared bga rework system
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CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor

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Product Detail
Brand Name :
UNICOMP
Model Number :
CX3000
Certification :
CE, FDA
Place of Origin :
China
MOQ :
1Set
Price :
can negotiate
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CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor

Unicomp Technology

Verified Supplier
8 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Unicomp X Ray, Electronics X Ray Machine, Industrial X Ray Machine
Total Annual :
60 Million-100 Million
Employee Number :
600~700
Certification Level :
Verified Supplier
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