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High Automation Bga X Ray Machine For Dry Joint Detection And Analysis
High Automation Bga X Ray Machine For Dry Joint Detection And Analysis
Specifications
Brand Name :
UNICOMP
Model Number :
AX8500
Certification :
CE, FDA
Place of Origin :
China
MOQ :
1Set
Price :
can negotiate
Payment Terms :
T/T, L/C
Supply Ability :
300 sets per month
Delivery Time :
30 days
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Name :
X-ray Inspection Machine
System Magnification :
500 x
Industry :
Electronics Industry
Tilt Detection Angle :
60°
X-ray Leakage :
< 1uSv/h
Weight :
1500kg
Description

Dry joint detection and analysis BGA X-Ray Inspection Machine​

X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. ( Offline X - Ray series ) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on.

Item Definition Specs
Motion Control System Motion Control Mode Mouse&Joystick&Keyboard
Max.Load Dimension 500x500mm
Max.Detection Dimension 350x450mm
Tilt Detection Angle 60°
X-Ray System Tube Type Closed
Voltage/Current 100kv/200μA
Focal Spot Size 5μm
FPD Detector FPD
Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm
Weight 1500 kg
Power 2kW
System Magnification 500 x
Leakage Dose <1μSv/h

X-ray Inspecting Features:
(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.

(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such

as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.

(3) The test preparation time is greatly reduced.

(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.

(5) Double layers board and multi-layer boards only one check (with layered function).

(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.

Inspection Images:

Product tags

tech 2 diagnostic scan tool

,

tech ii diagnostic tool

,

xray inspection system
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High Automation Bga X Ray Machine For Dry Joint Detection And Analysis

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Product Detail
Brand Name :
UNICOMP
Model Number :
AX8500
Certification :
CE, FDA
Place of Origin :
China
MOQ :
1Set
Price :
can negotiate
Contact Supplier
High Automation Bga X Ray Machine For Dry Joint Detection And Analysis

Unicomp Technology

Verified Supplier
8 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Unicomp X Ray, Electronics X Ray Machine, Industrial X Ray Machine
Total Annual :
60 Million-100 Million
Employee Number :
600~700
Certification Level :
Verified Supplier
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