Applications
EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection
The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation. Supported by a powerful and easy to use software interface, the AX-8200 is capable of addressing small and large volume factory requirements. (Contact us for details)
Item | Definition | Specs |
System Parameters | Size | 1080(L)x1180(W)x1730(H)mm |
Weight | 1150kg | |
Power | 220AC/50Hz | |
Power Consumption | 0.8kW | |
X-ray Tube | Type | Closed |
Max.Voltage | 90kV/100kV | |
Max.Power | 8W | |
Spot Size | 5μm | |
X-ray System | Intensifier | 4"Image Intensifier |
Monitor | 22"LCD | |
System Magnification | 600x | |
Detection Region | Max.Loading Size | 510mm x 420mm |
Max.Inspection Area | 435mm x 385mm | |
X-ray Leakage | < 1uSv/h |
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