High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking
Description of IC X Ray machine AX7900:
It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, small-scale metal casting, electronic connector modules, cables, aerospace components, as well as the photovoltaic industry, among others.
FEATURES of IC Xray machine AX7900:
Technical Specifications of AX7900
Item | Definition | Specs |
System Parameters | Size | 1280(L)x1220(W)x1615(H)mm |
Weight | 1100kg | |
Power | AC 110/220V, 50/60Hz | |
Power Consumption | 1.0kW | |
X-ray Tube | Type | Sealed |
Max.Voltage | 0~90kV (Adjustable) | |
Max.Power | 8W | |
Spot Size | 5μm | |
X-ray System | Intensifier | FPD |
Monitor | 224‘’LCD | |
System Magnification | 600X | |
Detection Region | Max.Loading Area | 520mm x 420mm |
Max.Inspection Area | 460mm x 400mm | |
X-ray Leakage | <1μSv/h (Meets All International Standards) |
Inspection Images of IC X Ray machine AX7900: