Product Description: High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC...learn more
AX9100 130kV Electronics X Ray Machine For Semiconductor Wire Bonding Sweep Inspection

AX9100 130kV Electronics X Ray Machine For Semiconductor Wire Bonding Sweep Inspection
300 sets per month
can negotiate
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Unicomp Technology

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8 Years
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