Introduction:

Copper foam is a porous metal material with many unique properties and applications. It is made by adding bubble foaming agent to copper alloy, and then sintering and cooling at high temperature.

Characteristic:

1. Porous structure: Copper foam has a continuous pore structure, and the pores are connected to each other to form an open pore network.
2. Low density: The density of copper foam is relatively low, usually between 0.2-1.0 g/cm³, and has a lighter weight.
3. High specific surface area: Due to its porous structure, copper foam has a large specific surface area, which is conducive to reactions such as adsorption, catalysis, and mass transfer.
4. Excellent thermal conductivity: Copper foam has good thermal conductivity, and the thermal conductivity is usually between 100-400 W/(m·K).
5. Good mechanical properties: Although copper foam has a porous structure, it still has high strength and rigidity.
6. Electromagnetic shielding performance: Copper foam has good electromagnetic shielding performance and can be used in electronic devices and communication equipment.

Parameter:

1. Porosity: The porosity of copper foam refers to the proportion of pore volume in its total volume, usually between 70-95%.
2. Pore size: The pore size of copper foam can be adjusted according to specific application requirements, usually between 0.1-5.0 mm.
3. Pore distribution: The pore distribution of copper foam can be uniform or non-uniform, and can be designed according to application requirements.
4. Density: The density of copper foam depends on the porosity and material composition, usually between 0.2-1.0 g/cm³.
5. Thermal conductivity: The thermal conductivity of copper foam is usually between 100-400 W/(m·K). The specific value is related to the material preparation method and composition.