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Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package
Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package
Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package
Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package
Specifications
Brand Name :
Direction Chemical
Model Number :
DY-P404
Certification :
ISO9001
Place of Origin :
China
MOQ :
500Kgs
Price :
USD2.90~3.90/Kg
Payment Terms :
D/A, L/C, D/P, T/T
Supply Ability :
1000T/month
Delivery Time :
5-8 working days
Packaging Details :
25Kgs/bag
Acid value :
≤5mg KOH/g
Amine Value :
≤3mg KOH/g
Viscosity :
10000-20000mpa.s/200ºC
Softening point :
120±5ºC
Color,(Fe-Co) :
≤8
Tensile Strength :
≥20 MPa
Water absorption :
≤ 0.4%
Shear Strength :
≥11 MPa, AL/AL
Stretch Rate :
≥800 %
Peeling strength :
≥ 100N/25mm,PE/PE,60±2ºC
Operating Temperature :
160-200ºC
Description

Polyamide Hot-melt Adhesive/Hemming Adhesive (DY-P404)

1.Appearance:

Yellowish round grain with schistose shape

2.Property:

DY-P404 is a general type of polyamide hot-melt adhesive, which is made from dimer acid and polyamine through condensation reaction at high temperature.

It can dissolve in general organic solvents, the hot-melting viscosity of the resin is greatly related to the temperature that it gets.

The polyamide hot-melt adhesive possesses the following advantages, such as lower viscosity, good fluidity, good flexibility, high adhesive strength, good media corrosion resistance, good solubility and fluxing property at low temperature, higher heat stability etc.

3.Application

This type of resin is applied in heat-shrinkable sleeve for electric cable, sealing material for electrical connection, cementing or fixing materials for electronic component, bonding material for package, textile, leather, wood, plastic, metal and ceramics etc.

4.Technologic Index

Acid Value,(mg KOH/g ≤) 5
Amine Value,(mg KOH/g≤) 3
Viscosity,(mpa.s/200ºC) 10000-20000
Softening Point,(ºC) 120±5
Color,(Fe-Co ≤) 8
Tensile Strength, (≥ MPa) 20
Water absorption, (≤ %) 0.4
Shear Strength, (≥ MPa, AL/AL) 11
Stretch Rate, (≥ %) 800

Peeling strength,

(≥ N/25mm,PE/PE,60±2ºC)

 100
Operating Temperature( ºC ) 160-200
5.Packaging & Storage

Double packing: PP textile bag lined with PE film or paper-plastic composite bag lined with PE film.

Net weight is 25Kgs per bag.

Store in cool, airy and dry place, the package has to be sealed before using up the resins.

Product tags

permatex glue for plastic

,

expanded polystyrene products tapers

,

ms polymer glue
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Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package

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Product Detail
Brand Name :
Direction Chemical
Model Number :
DY-P404
Certification :
ISO9001
Place of Origin :
China
MOQ :
500Kgs
Price :
USD2.90~3.90/Kg
Contact Supplier
Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package
Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package

SuZhou Direction Chemical Technology Co.,Ltd

Verified Supplier
9 Years
jiangsu
Since 2013
Business Type :
Manufacturer, Agent, Importer, Exporter, Trading Company, Seller
Main Products :
Vinyl Chloride Vinyl Acetate Copolymer Resin, Vinyl Resin, Vinyl Copolymer Resin
Total Annual :
16000000-19000000
Employee Number :
60~100
Certification Level :
Verified Supplier
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