Product Description:

• The Multi Horizontal Wafer Jars are designed to perfectly match foam and liners to safely transport silicon wafers. These jars come in a variety of sizes, ranging from 4 inches to 12 inches, and depths ranging from 22.86 to 76.2mm.
• Depending on the thickness of the chip, it can hold between 10 to 25 pieces. With different quantities that can be loaded according to demands, the Multi Horizontal Wafer Jars are the perfect solution for transporting wafers and ensuring their safety during transportation.

Technical Parameters:

Applications:

• Aerospace:

Ensuring the safety and reliability of high-precision components in the aerospace industry.

• Consumer Electronics:

Component manufacturing for consumer electronics products such as smartphones and tablets

• Optoelectronic Industry:

Used for the manufacturing and testing of optoelectronic devices to ensure the safety of optoelectronic wafers.

Support and Services:

• 24/7 customer service support
• Free technical support for all customers
• Troubleshooting assistance
• Help with installation and setup
• Regular product updates
• Product training and tutorials

Packing and Shipping:

• This includes the name and address of the recipient, the sender's address, and a description of the contents. If the Wafer Jar contains any fragile items, these should be marked clearly on the box. Additionally, any items that require special handling or require special packaging should be clearly indicated. The box should then be securely sealed with shipping tape.

• The box should be placed in a larger box with appropriate cushioning material and the appropriate shipping label should be affixed to the box. The box should then be taken to the appropriate shipping provider (UPS, FedEx, etc.) and shipped according to their shipping policies and procedures.

FAQ: