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Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer
Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer
Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer
Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer
Specifications
Brand Name :
Hiner-pack
Model Number :
HWS-HN100~200mm-Round Foam
Place of Origin :
China
Certification :
ISO 9001 ROHS
MOQ :
500PCS（Negotiable）
Price :
Prices vary with delivery methods and quantities
Packaging Details :
Inner Bag
Delivery Time :
1~2 Weeks
Payment Terms :
100% Prepayment
Supply Ability :
About 2000Pcs Per Day
Property :
Avoid Corrosion
Brand :
Hiner-pack
Breathability :
High
Name :
Foam Cushion Pad
Thickness :
5mm(A Variety Of Options)
Surface Resistance*1 :
1.0*10E4~1.0*10E11Ω
Property*2 :
Good Shock Resistance
Durability :
High
Description

Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer
Product Description:

wafer foam separator is a specialized component used in the semiconductor manufacturing process, particularly in the handling and packaging of wafers. Here are some key points about it:

Purpose: The primary function of a wafer foam separator is to protect wafers from physical damage and contamination during transport and storage. It provides cushioning and prevents direct contact betweenwafers.

Material: Typically made from soft, flexible foam materials, these separators can absorb shocks and vibrations, which helps in maintaining the integrity of delicate silicon wafers.

Design: The separators are designed to fit between individual wafers, often with cutouts or grooves that accommodate the specific dimensions of the wafers, ensuring a snug fit.

Applications: Wafer foam separators are commonly used in various stages of semiconductor fabrication, including during the transport between different processing steps, as well as in storage and shipping containers.

Benefits: Using wafer foam separators reduces the risk of scratches, chips, and other types of damage that can occur during handling, ultimately improving yield and reliability in semiconductor products.

Overall, wafer foam separators play a crucial role in ensuring the safe handling of semiconductor wafers throughout the manufacturing process.

Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer

Parameter

Value

Material

Antistatic Polyethylene

Origin

China

Breathability

High

Durability

High

Property

Avoid Corrosion

Property*2

Good Shock Resistance

Surface Resistance*1

1.0*10E4~1.0*10E11Ω

Shape

Round

Size

4~12 Inch/100~300mm

Property*1

No Organic Pollution
Key Features
Description
Color
Pink
Placement
Horizontally In The Wafer Shipper
Shock Absorption
Provides cushioning and protection against shocks
Product tags

extruded foam insulation board

,

closed cell foam material

,

high density closed cell foam
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Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer

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Product Detail
Brand Name :
Hiner-pack
Model Number :
HWS-HN100~200mm-Round Foam
Place of Origin :
China
Certification :
ISO 9001 ROHS
MOQ :
500PCS（Negotiable）
Price :
Prices vary with delivery methods and quantities
Contact Supplier
Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer
Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer

Shenzhen Hiner Technology Co.,LTD.

Verified Supplier
2 Years
shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Main Products :
Wafer Carrier Box, Wafer Shipping Box, Wafer Storage Box
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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