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12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring
12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring
12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring
12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring
12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring
12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring
Specifications
Brand Name :
Hiner-pack
Model Number :
HN24817
Certification :
ISO 9001 ROHS SGS
Place of Origin :
China
MOQ :
10PCS
Price :
$1~$100/PCS
Payment Terms :
T/T
Supply Ability :
100PCS/Day
Delivery Time :
2-3 Weeks
Packaging Details :
4~10pcs/carton (According to the customer demand）
Size :
12 inch
Features :
Anti-static, corrosion resistant, durable
Application :
Wafer storage and transportation
Color :
Silver Gray
Material :
Stainless Steel
Description

Product Description:

• Heat treatment process Wafer ring has good resistance to rebound after heat treatment.

• Precision machining precision Wafer Iron Ring using laser cutting machine, cutting error is small.

• Compatible with various packaging devices Compatible with frame processing device (Disco, TSK, ADT, etc.)

Feature:

Suitable workmanship wafer sticking, wafer grinding, wafer cutting and SMT etc
Suitable for 12" wafers
Material SUS420J2
Hardness 50~55 HRC
Dimension High dimensional precision ensures sticking effectiveness
Surface polishing Matt, light and electroplate mirror face
Packing Note Packing after cleaning and drying

12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring

Advantage:

♦ Adopting heat treatment technology, it has strong bending resistance, toughness and durability, and can be reused repeatedly.

♦ Good adhesion, high flatness, not easy to bubble, good adhesion.

♦ Carefully polished, the surface is smooth and free of burrs, ensuring safe and reliable use.

12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring

Application:

• Lon implantation process:The stainless steel tension ring on the wafer can firmly clamp the wafer during ion implantation, allowing it to accurately receive ion beam implantation.

• Manufacturing of battery cells:It can fix the silicon wafer in the corresponding equipment, ensuring the accuracy and consistency of the process.

12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring

Laser cutting with high accuracy Surface electropolishing treatment

Packing and Shipping:

Adopt moisture-proof, shock-proof and pressure-proof packing method.

  • Choose sturdy cartons, wooden boxes or iron drums and other packaging containers.
  • Fill the interior with cushioning materials such as foam, bubble bags,Label the outer package with product information, delivery address, etc.

​Choose a regular international logistics company.

  • According to the mode of transportation (sea, air, etc.) to do a good job of storage, loading and unloading
  • Maintain temperature and humidity control throughout the transportation of goods. Properly handle the return and exchange of goods due to transportation damage.
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12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring

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Product Detail
Brand Name :
Hiner-pack
Model Number :
HN24817
Certification :
ISO 9001 ROHS SGS
Place of Origin :
China
MOQ :
10PCS
Price :
$1~$100/PCS
Contact Supplier
12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring
12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring
12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring

Shenzhen Hiner Technology Co.,LTD.

Verified Supplier
2 Years
shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Main Products :
Wafer Carrier Box, Wafer Shipping Box, Wafer Storage Box
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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