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Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry
Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry
Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry
Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry
Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry
Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry
Specifications
Brand Name :
WINNER
Model Number :
WNE T9
Certification :
ISO9001
Place of Origin :
China
MOQ :
1pc
Price :
1~999
Payment Terms :
T/T, Western Union, L/C
Supply Ability :
1000000 rolls per month
Delivery Time :
5~8 working days.
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Diameter :
0.001mm - 0.05mm
Breaking Load BL(gf) :
>4
Elongation EL(%) :
3-20
Wire Bonding Type :
Ball Bonding, Wedge Bonding, Ribbon Bonding
Material :
Aluminum
Application :
Semiconductor, Electronics, Medical Devices
Bonding Method :
Thermocompression, Ultrasonic, Laser
Description

Superior Aluminum Bonding Wire for Precision Bonding in Microelectronics and Power Semiconductor Industry

In the fast - evolving microelectronics power semiconductor industry, our Superior Al Wire Bonding solution stands out.

Made from high - quality aluminum, our wire exhibits outstanding performance. Aluminum's excellent electrical conductivity ensures efficient power transfer, which is vital for power semiconductor applications. It allows for rapid and accurate signal transmission, reducing power losses and enhancing overall device efficiency.

Precision is the key feature of our product. The wire is designed to achieve micron - level bonding accuracy, meeting the stringent requirements of microelectronics. This high - precision bonding ensures reliable connections in even the most complex power semiconductor circuits. Whether for high - power integrated circuits or miniaturized power modules, our Al wire bonding solution provides consistent and stable performance, enabling the development of more advanced and reliable microelectronic devices.

Al Wire for Power

Type

Ø Diameter

(μm)

Breaking Load

BL(gf)

Elongation

EL(%)

Length

Meters

WNE T1

100±5

50~100

10~30

500/1000/2000

125±5

60~120

10~30

500/1000/2000

150±5

100~200

10~30

500/1000/2000

170±5

140~240

10~30

500/1000/2000

200±7

150~250

10~30

500/1000/2000

Bonded aluminum wire applications:

*Automotive electronics

*Consumer electronics

*Computing equipment

*Chip on board (COB) technology

*Bonding of discrete components (diodes, transistors, capacitors, resistors)

*Bonding of hybrid components

Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

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Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

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Product Detail
Brand Name :
WINNER
Model Number :
WNE T9
Certification :
ISO9001
Place of Origin :
China
MOQ :
1pc
Price :
1~999
Contact Supplier
video
Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry
Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry
Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
1 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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