* Made of ≥99% high purity gold/silver material with added alloy elements;
* The surface has been treated with composite materials, with a stable structure and excellent electrical and thermal conductivity;
* Compared to gold wire, it has a lower cost and a significant competitive advantage in price;
* Widely used in ICLED and other packaging;
Silver alloy Bonding Wire AG99% | ||||
Type | Ø Diameter ±1% μm | Breaking Load BL(gf) | Elongation EL(%) | Length Meters |
YF-99 | 18(0.7mil) | >4 | 3-20 | 500/1000 |
99B | 20(0.8mil) | >5 | 3-20 | 500/1000 |
SW-21 | 23(0.9mil) | >7 | 3-20 | 500/1000 |
99A | 25(1.0mil) | >8 | 3-20 | 500/1000 |
99A | 30(1.2mil) | >11 | 3-20 | 500/1000 |
Note: The above Diameter, BL and EL parameters can be customized according to customer requirements.
Application: