Strong and Durable Palladium Coated Copper Wire for Optoelectronic Packaging
Material and Composition of the Bonding Wire
Our gold - plated/palladium bonding wire is crafted with precision from 4N high - purity copper material. This copper is of an exceptional quality, with a purity level that ensures its fundamental reliability and excellent electrical conductivity. But it doesn't stop there. We have also incorporated a certain proportion of trace elements into this copper base. These trace elements are added in a carefully controlled manner, as they play a vital role in enhancing the overall performance of the bonding wire. Each trace element has been selected based on extensive research and experimentation to bring out specific desired properties.
Unique Characteristics
This bonding wire not only inherits the characteristics of conventional copper wire but also exhibits a series of remarkable additional features. Firstly, it has high strength. This means that it can withstand significant mechanical stress during various manufacturing processes and in its actual application environment. Whether it's during the wire - bonding operation in IC packaging or when subjected to external forces in the long - term usage, its high strength ensures that it remains intact and functional.
Application in IC Packaging
This surface gold/palladium special bonding wire has been specifically developed for IC packaging. In the complex and demanding world of integrated circuit manufacturing, the quality of the bonding wire can have a significant impact on the performance and reliability of the final product. Our wire's unique combination of properties makes it an ideal choice for connecting different components within the IC. It provides stable electrical connections, withstands the mechanical stress during the packaging process, and remains resistant to oxidation, arcs, and corrosion over the long term. This ensures that the integrated circuit functions optimally and has a long - term stable performance, meeting the high - quality requirements of modern electronics manufacturing.
Pd Coated Copper Wire |
Type | Ø Diameter ±1% μm | Breaking Load BL(gf) | Elongation EL(%) | Length Meters |
PW-1 | 18(0.7mil) | >4 | 8-14 | 500/1000/2000 |
20(0.8mil) | >5 | 9-15 | 500/1000/2000 |
23(0.9mil) | >7 | 10-17 | 500/1000/2000 |
25(1.0mil) | >9 | 11-17 | 500/1000/2000 |
30(1.2mil) | >14 | 14-22 | 500/1000/2000 |
Note: The above Diameter parameters can be customized according to customer requirements.
Application:
Applications of palladium-plated copper wire: Can be used in integrated circuits, semiconductor packaging, LED packaging, optoelectronic packaging, etc.

1.What kind of Enameled copper wire do Winner produce?
We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.
2.What's diameters available of the Enamelled copper wire ?
We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.
3.What's selfbonding enameled copper wire?
Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated
by heat or solvents.
Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.
The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications
as bobbins, tape, varnishing, or impregnation may be eliminated.
4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?
Of course you can!




