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Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Specifications
Brand Name :
WINNER
Model Number :
WGBW-5
Certification :
ISO 9001, ISO 14001, RoHS
Place of Origin :
China
MOQ :
1pc
Price :
1~999
Payment Terms :
T/T, Western Union, L/C
Supply Ability :
1000000 rolls per month
Delivery Time :
5~8 working days.
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Density :
19.34 g/cm3
Purity :
99.999%
Material :
Gold
Tensile Strength :
100 - 500 MPa
Bonding Method :
Ultrasonic, Thermocompression, Laser
Temperature Range :
-40°C to 200°C
Package :
Spool, Reel, Coil
Melting Point :
1063°C
Description

Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies

Winner offers a wide selection of ball, wedge and stud bonding wires in a varied portfolio of 5N 99.999 / 4N 99.99 / 3N 99.9 / 2N 99.0.
* Raw materials of high purity (99,999 %)
* Stable mechancial qualities
* Wire surface of high quality
* Made according to customer specifications
* With a diameter down to a size of 0.6 mils / 15 microns for very fine applications.
* For ball or wedge bonding or stud bumping
Gold bonding wire offers several advantages over other types of wire. Winner can control the diameter of gold bonding wires depending on the customers’ requests. Winner is a leading supplier of metallic bonding wires.
The gold bonding wire is a kind of material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. Winner can provide Au bonding wire with different wire diameters from 10um-40um according to customer requirements.

Physical Properties

Density:
19.34 g/cm3
Melting Point:
1063°C
Electrical Resistivity: (@20°C)
2.3 μΩ-cm
Electrical Conductivity: (@20°C)
75% (IACS)
Thermal Conductivity: (@20°C)
315 W/(m-K)
Fusing Current (10 mm x 25 μm)
0.52 A
We take pride in offering a complete range of wire diameters, thereby fulfilling the diverse needs for strength and elongation in different wire applications. Moreover, we collaborate closely with our customers to provide customized solutions. In these custom solutions, technical parameters such as tensile strength and elongation are meticulously tailored to meet their specific requirements. This customer-centric approach enables us to not only meet but exceed the expectations of our clients in the highly competitive market of wire manufacturing and bonding applications.
Composition
Diameter
Tensile Strength (gms)
Elongation (%)
99.99% Au
0.7 mil
17.5 μm
3 - 10
2 - 6
0.8 mil
20 μm
4 - 13
2 - 7
0.9 mil
22.5 μm
5 - 16
2 - 8
1.0 mil
25 μm
6 - 20
2 - 8
1.3 mil
32.5 μm
10 - 45
2 - 10
1.5 mil
37.5 μm
13 - 50
2 - 12
1.7 mil
42.5 μm
15 - 60
2 - 12
1.8 mil
45 μm
20 - 70
2 - 12
2.0 mil
50 μm
25 - 85
2 - 15
3.0 mil
75 μm
50 - 180
2 - 20
Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications rangining from high pin-count, ultra-fine pitch microelectronic devices to high-power discrete components. Au is the preferred choice of bonding material when a) the contact material is not compatible with Aluminum (Al) and/or Copper (Cu) b) the contact area is limited c) the device will be subject to high temperature or high humidity environments.
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.

Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies

Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies

Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies

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Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies

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Product Detail
Brand Name :
WINNER
Model Number :
WGBW-5
Certification :
ISO 9001, ISO 14001, RoHS
Place of Origin :
China
MOQ :
1pc
Price :
1~999
Contact Supplier
video
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
1 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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