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Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity
Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity
Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity
Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity
Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity
Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity
Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity
Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity
Specifications
Brand Name :
WINNER
Model Number :
WCBW-7
Certification :
ISO 9001, ISO 14001, RoHS
Place of Origin :
China
MOQ :
1pc
Price :
1~999
Payment Terms :
T/T, Western Union, L/C
Supply Ability :
1000000 rolls per month
Delivery Time :
5~8 working days.
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Diameter :
0.01mm - 0.4mm
Material :
Copper
Product Type :
Bonding Wire
Application :
Semiconductor Packaging
Purity :
99.999%
Availability :
Custom sizes available
Density :
8.96 g/cm3
Thermal Conductivity :
100-400 W/mK
Description

Copper Bonding Wire Ultra Fine wire 0.01 mm with High Levels of Electrical and Thermal Conductivity

In many applications, copper wire bonding can provide better performance and reliability than gold wire bonding. Winner can provide Copper bonding wire with different wire diameters from 10um-40um according to customer requirements. Copper bonding wires have grown in popularity as a means of making interconnects in an elecronics package, thanks to it's lower costs than materials such as gold, as well as high levels of electrical and thermal conductivity, and good reliability at high temperatures.
Characteristics
* High conductivity
* High tensile strength with high elongation
* Good loop stability
* Significantly reduced formation of intermetallic phases
* Very good ball formation under protective gas
Applications include:
* Computer : PC, Tablets, Servers & systems, Consumer
* Electronics : Smartphones & phones, TVs, Imaging devices, Wearable electronics
* Automotive : Body, Safety, Infotainment, Chassis, Powertrain, Security
* Communications : Wireless, Wired, Satellite, NFC
* Energy : Generation, Transmission & distribution, Storage
Dia EL(%) BL(gf)
mil um 4N 5N 4N 5N
WCBW-1 WCBW-2 WCBW-3 WCBW-4 WCBW-5 WCBW-6 WCBW-7 WCBW-8
0.6 15 3-15 3-15 3-16 3-17 >3.0 >3.0 >3.0 >3.0
0.7 18 3-17 3-17 3-18 4-19 >3.0 >3.0 >3.5 >4.0
0.8 20 4-18 4-18 4-19 5-20 >4.0 >4.5 >5.0 >5.0
0.9 23 6-20 6-20 6-21 6-22 >5.0 >6.0 >6.0 >6.5
1.0 25 8-22 8-23 8-24 8-24 >6.0 >7.0 >7.0 >8.0
1.2 30 9-23 9-24 9-25 9-26 >8.0 >8.5 >8.0 >10.0
1.3 33 9-24 10-25 10-26 10-27 >10.0 >11.0 >10.0 >12.0
1.5 38 10-25 10-26 10-27 11-28 >12.0 >12.0 >12.0 >14.0
1.7 43 10-26 11-28 10-30 11-30 >15.0 >16.0 >15.0 >18.0
2.0 50 12-28 12-30 12-32 12-34 >20.0 >20.0 >20.0 >20.0
The Advantages of Copper Bonding Wire Cost Savings
The relatively low cost of copper is one of the reasons for its appeal as an alternative interconnect material. By replacing gold wires with copper material, thus replacing the precious metal part, significant cost savings are possible. In applications that require increased wire diameters, the usage of copper bears a disproportionately high impact on the saving effect. Superior Performance of Copper Wires Copper exhibits significantly better conductivity than gold or aluminum. Therefore better heat dissipation and increased power ratings are attainable with thinner wire diameters. Copper possesses higher mechanical properties compared to gold. Therefore it displays excellent ball neck strength and high loop stability during molding or encapsulation.

Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity

Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity

Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity

Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity

Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity

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Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity

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Product Detail
Brand Name :
WINNER
Model Number :
WCBW-7
Certification :
ISO 9001, ISO 14001, RoHS
Place of Origin :
China
MOQ :
1pc
Price :
1~999
Contact Supplier
video
Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity
Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity
Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity
Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
1 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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