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Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production
Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production
Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production
Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production
Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production
Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production
Specifications
Brand Name :
WINNER
Model Number :
PW-24
Certification :
ISO9001
Place of Origin :
China
MOQ :
1pc
Price :
1~999
Payment Terms :
T/T, Western Union, L/C
Supply Ability :
1000000 rolls per month
Delivery Time :
5~8 working days.
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Elongation :
10%
Color :
Silver
Material :
Copper
Coating :
Palladium
Application :
Electronics
Surface Finish :
Smooth
Description

Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production

The Precision-Engineered 15μm Pd-Cu Bonding Wire sets a new benchmark in sustainable semiconductor manufacturing. Featuring ultra-fine pitch compatibility (≤35μm), this wire enables flawless interconnects in advanced IC packaging, MEMS devices, and miniaturized IoT sensors, while reducing short-circuit risks by 90%. Its palladium-copper alloy core delivers 98% IACS conductivity and 50% higher corrosion resistance than standard copper wires, ensuring longevity in harsh environments like automotive and industrial chips.

Certified RoHS/REACH compliant, this lead-free solution supports green electronics production with 40% lower carbon footprint compared to gold bonding alternatives. The nano-smooth surface finish minimizes ionic contamination, critical for aerospace-grade semiconductor reliability under extreme thermal cycling (-55°C to +200°C).

Optimized for high-speed wire bonding machines, it achieves 25% faster production cycles without compromising bond strength. Trusted by global Tier-1 OEMs, this wire combines eco-conscious engineering with cutting-edge performance, driving the transition to energy-efficient chip fabrication.

Material and Composition of the Bonding Wire
Our gold - plated/palladium bonding wire is made from 4N high - purity copper. The high purity ensures reliability and good electrical conductivity. We also added a proportion of trace elements in a controlled way. These elements, selected through research, enhance the wire's performance.

Unique Characteristics
the welding wire is corrosion - resistant. Corrosion can cause serious damage to the wire and lead to failure of the entire packaging system. Our special bonding wire is formulated to resist corrosion from various chemical substances that it may come into contact with during its use, whether it's in the manufacturing environment or during the normal operation of the IC.

Application in IC Packaging
This special gold/palladium bonding wire is for IC packaging. Its properties make it ideal for connecting IC components, providing stable electrical connections, withstanding mechanical stress, and resisting oxidation, arcs, and corrosion for optimal and stable IC performance, meeting modern electronics manufacturing requirements.

Pd Coated Copper Wire

Type

Ø Diameter

±1% μm

Breaking Load

BL(gf)

Elongation

EL(%)

Length

Meters

PW-1

18(0.7mil)

>4

8-14

500/1000/2000

20(0.8mil)

>5

9-15

500/1000/2000

23(0.9mil)

>7

10-17

500/1000/2000

25(1.0mil)

>9

11-17

500/1000/2000

30(1.2mil)

>14

14-22

500/1000/2000

Note: The above Diameter parameters can be customized according to customer requirements.

Application:

Applications of palladium-plated copper wire: Can be used in integrated circuits, semiconductor packaging, LED packaging, optoelectronic packaging, etc.

Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production

Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production

Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production

Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production

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Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production

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Product Detail
Brand Name :
WINNER
Model Number :
PW-24
Certification :
ISO9001
Place of Origin :
China
MOQ :
1pc
Price :
1~999
Contact Supplier
Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production
Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production
Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
1 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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