1. Hot air head and mounting head integration design, with auto soldering and desoldering functions.
2. Independent 3 heaters, upper and lower heaters can realize move synchronously and automatically,can reach IR every position.Lower heater zone can remove up and down,support PCB board. bottom pre-heating area along X/Y axis. Lower heater can move up/down and support PCB,auto-controlled by motors. It can realize the upper and lower heater able to move towards target BGA, without moving PCB.
3. PCB board adopts high accuracy slider to make sure the mount precision of BGA and PCB.
4. Unique bottom preheating table made of Germany-imported good quality heating materials plated IR tube & constant temperature glass anti-dazzle (heat-resist up to 1800 C), pre-heating area up to 500*420mm.
| Power supply | AC 220V±10％ 50/60Hz |
| Total power | 7600W |
| Heater power | Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 5000W |
| Electrical material | High sensitive touch screen+temperature control module+PLC+step driver |
| Temperature controlling | High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±2℃ |
| Locating way | V shape holder&universal jigs |
| PCB size | Max610×500mm Min 10×10 mm |
| Applicable chips | Max90×90mm Min 0.3×0.6mm |
| PCB thickness | 0.5-8mm |
| Mounting precision | ±0.01mm |
| Overall dimension | L780*W980*H950mm(without frame) |
| Thermo-couple Ports | 5 pcs |
| Weight of machine | 140KG |
| Alignment system | Optical lens+HD industrial camera |
