Specification and Feature:
- Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
- PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate.
- High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
- Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
- Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )
Technology Parameter:
Power |
6800W |
Up heater power |
1200W |
Down heater power |
1200W |
IR heater power |
4200W(2400W control) |
Power supply |
(Single Phase) AC 220V±10 50Hz |
Position way |
Optical lens+ Vshape holder+laser positioning |
Temperature control |
High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃ |
Material |
High sensitive touch screen+temperature control module+PLC+step drive |
PCB Size |
Max:500×450mm , Min: 10×10mm |
Thermo-couple Ports |
4pcs |
Chips magnification times |
2-30 |
PCB thickness |
0.5-8mm |
GA size |
0.8mm-8cm |
Min.chips pitch |
0.15mm |
Mounting BGA weight |
1000G |
Mounting precision |
±0.01mm |
Overall dimension |
L670×W780×H850mm |
Optical alignment lens |
Motor drive can move front back right left |
Weight of machine |
About 90kg |