Application Fields of X-ray machine

1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.

2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.

3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.

4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.

5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.

6) Inner rupture or hollow inspection in plastic or metal.

7) Battery stacking uniformity, electrode welding inspection.

Standard configuration

1. Adjust the speed of the stage through the space bar: slow, normal, fast

2. Keyboard control X, Y, Z1 Z2 the four-axis movement.

3. The user can control the speed of the stage by programming

Fully automatic BGA detection program

1.Simple mouse click to write program.

2.Automatic analysis on diameter, proportion of cavity, area and roundness of BGA.

3.Automatic BGA detection program has high repeatability of detection results for process control.

4.The test results will be displayed on the screen and can be output to excel for review.

CNC programming

1. Simply mouse click to write detection program.

2. Sample tablecan be positioned in X, Y direction; X-ray optical tube and detector can be positioned in Z direction.

3. Software set voltage and current.

4. Image settings: brightness, contrast, auto gain and exposure.

5. Users can set the pause time for program switching.

6. Anti-collision system can meet the maximum tilt and observation.

Our Services

Help customer analyze product project and provide detection solution.

Freely sample detection test.

Provide professional detection solution.

Skilled jig design services.

Provide shipping/delivery information checking service.

One year guarantee, all life maintain promise.

24 hours feedback speed by email of others.