Description | Technology & Capabilities | | | | | ||||
1. Quality Grade | Standard IPC 2-3 | | | | | ||||
2. Number of Layers | 1 - 32layers | | | | | ||||
3. Base Material | FR-4 Glass Epoxy laminate, Aluminium base, RCC | | | | | ||||
4. Surface Finish | Electroless nickel Immersion gold ( Electoless Ni/Au). Organic Solerability Preservatives ( OSP or Entek). Hot Air Leveling ( Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers. Immersion Silve. Immersion Tin. Flash gold ( Electrolytic) | | | | | ||||
5. Major Laminate | King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers and others. | | | | | ||||
6. Via Holes | Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH | | | | | ||||
7. Copper Foil Thickness | 18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz) 18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz) | | | | | ||||
8. Min. Via Size and Type | Dia. 0.15mm (Finished). Aspect Ratiao = 12; HDI holes (<0.10mm) | | | | | ||||
9. Min. Line Width & Spacing | 0.75 mm/ 0.10mm ( 3mil/ 4mil) | | | | | ||||
10. Min Via Hole Size & Pad | Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI<0.10mm via | | | | | ||||
11. Impedance I Control Tol. | +/- 10% ( min. +/- 7 Ohm) | | | | | ||||
12. Solder Mask | Liquid Photo- Image (LPI) | | | | | ||||
13. Profiling | CNC Routing, V- Cutting, Punching, Push back punching, Connector chamfering | | | | | ||||
14. Capacity | 100 k㎡ output monthly | | | | |
Item | Capability |
Base material | FR4,High-TG FR4,CEM3,aluminum, High Frequencey frequency(Rogers,Taconic,Aron,PTFE,F4B) |
Layers | 1-4 Layers(Alunimum), 1-32 layers(FR4) |
Copper Thickness | 0.5oz, 1oz, 2oz, 3oz,4oz |
Dielectric Thickness | 0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm |
Board Core Thickness | 0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm and 3.2mm |
Board Thickness | 0.4mm - 4.0mm |
Thickness Tolerance | +/-10% |
Aluminum Machining | Drilling, Tapping, Milling, Routing, Die-Punching, Break-off tab available |
Min Hole | 0.2 mm |
Min Track Width | 0.2mm (8mil) |
Min Track Gap | 0.2mm (8mil) |
Min SMD Pad Pitch | 0.2mm (8mil) |
Surface Finishing | HASL lead free,ENIG,Plated Gold,Immersion Gold,OSP |
Solder Mask Color | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
Legend Color | Black, White etc |
Assembly Types | Surface mount Thro-hole Mixed technology (SMT & Thru-hole) Single or double sided placement Conformal coating Shield cover assembly for EMI emission control |
Parts Procurement | Full Turnkey Partial Turnkey Kitted/Consigned |
Component types | SMT 01005 or larger BGA 0.4mm pitch, POP (Package on Package) WLCSP 0.35mm pitch Hard metric connectors Cable & wire |
SMT Parts Presentation | Bulk Cut tape Partial reel Reel Tube Tray |
Stencils | Laser-cut stainless steel |
Other Techniques | Free DFM Review Box Build Assembly 100% AOI test and X-ray test for BGA IC programming Components cost-down Function test as custom Protection technology |
| Sample Lead time | Mass production lead time | ||
Single sided PCB | 1~3 days | 4~7 days | ||
Double sided PCB | 2~5 days | 7~10 days | ||
Multilayer PCB | 7~8 days | 10~15 days | ||
PCB Assembly | 8~15 days | 2~4 weeks | ||
Delivery time | 3-7 days | 3-7 days | ||
Package: Anti-static Package with carton | | |