TIA600FG High Thermal Conductivity Double-Side Adhesive Tape LED Heat Transfer Fiberglass Thermal Tape
The TIA™600FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
Features
> Thermal Conductivity: 0.8W/mK
> High performance,thermally conductive acrylic adhesive.
> Hihg bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> Fire rating equate 94V0
Applications
> Mount heat sink onto BGA graphic processor or drive processor
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
Typical Properties of TIA™600FG Series | ||
Product Name | TIATM600FG Series | Test Method |
Color | White | Visual |
Adhesive Type | Acrylic Adhesive | ****** |
Backing Type | Fiberglass | ****** |
Continuous Use Temp | -45℃ to 120℃ | ****** |
Thickness range | 0.0050"-0.010" | ASTM D374 |
Dielectric Breakdown Voltage | > 1000 Vac | ASTM D149 |
180° Peel Adhesion | > 800 g/inch (Steel, Immediate) | PSTC-1 |
180° Peel Adhesion | > 800 g/inch (Steel, Immediate) | PSTC-1 |
Holding Power 25℃/Hours | > 48 Hours | PSTC-7 |
Holding Power 80℃/Hours | > 48 Hours | PSTC-7 |
Fire rating | Equate 94 VO | UL E31100 |
Thermal Conductivity | 0.8 W/mK | ASTM D5470 |
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Independent R&D team
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