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TIF100-40-11U Thermal Pad For GPU CPU Chip
TIF100-40-11U Thermal Pad For GPU CPU Chip
TIF100-40-11U Thermal Pad For GPU CPU Chip
TIF100-40-11U Thermal Pad For GPU CPU Chip
Specifications
Brand Name :
Ziitek
Model Number :
TIF100-40-11U
Certification :
UL and RoHs
Place of Origin :
Vietnam
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
Thermal Pad For GPU CPU Chip
Thermal Conductivity :
4.0W/mK
Density :
3.15g/cm³
Keywords :
Thermal Pad
Color :
Gray
Hardness :
27 Shore 00
Dielectric Breakdown Voltage :
>5500VAC
Application :
GPU CPU Chip
Description

Thermal Pad For GPU CPU Chip

The TIF™100-40-11U is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF100-40-11U is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

TIF100-40-11U Thermal Pad For GPU CPU Chip

Features:


> Good thermal conductive: 4.0W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized
> Moldability for complex parts
> Naturally tacky needing no further adhesive coating


Applications:


> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp

Typical Properties of TIF100-40-11U Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density 3.15g/cm³ ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ******
Hardness 27 Shore 00 ASTM 2240
Continuos Use Temp -40 to 160℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X10¹² ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 4.0W/m-K ASTM D5470


Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

Products Size:

8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
TIF100-40-11U Thermal Pad For GPU CPU Chip
Company Profile

With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Independent R&D team

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TIF100-40-11U Thermal Pad For GPU CPU Chip

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF100-40-11U
Certification :
UL and RoHs
Place of Origin :
Vietnam
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
TIF100-40-11U Thermal Pad For GPU CPU Chip
TIF100-40-11U Thermal Pad For GPU CPU Chip

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM

Verified Supplier
1 Years
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Thermal Pad, Thermal Grease, Phase Changing Materials
Total Annual :
1000000-16000000
Employee Number :
200~500
Certification Level :
Verified Supplier
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