Specifications
Brand Name :
Ziitek
Model Number :
TIF100-20-11US
Certification :
UL and RoHs
Place of Origin :
Vietnam
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
Ultra-soft silicone thermal pad
Thermal Conductivity :
2.0W/mK
Density :
2.7g/cm³
Keywords :
Thermal Pad
Color :
Gray
Hardness :
20±5 Shore 00
Dielectric Breakdown Voltage :
>5500VAC
Application :
Display card
Description

TIF100-20-11US Ultra-soft silicone thermal pad

The TIF™100-20-11US is an extremely soft gap filling material rated at a thermal conductivity of 2.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF100-20-11US is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

TIF100-20-11US Ultra-soft silicone thermal pad

Features:


> Good thermal conductive: 2.0W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized


Applications:


> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIF100-20-11US Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density 2.7g/cm³ ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ******
Hardness 20±5 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X10¹² ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 2.0W/m-K ASTM D5470


Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

Products Size:

8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
TIF100-20-11US Ultra-soft silicone thermal pad
Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

Send your message to this supplier
Send Now

TIF100-20-11US Ultra-soft silicone thermal pad

Ask Latest Price
Brand Name :
Ziitek
Model Number :
TIF100-20-11US
Certification :
UL and RoHs
Place of Origin :
Vietnam
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
TIF100-20-11US Ultra-soft silicone thermal pad
TIF100-20-11US Ultra-soft silicone thermal pad

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM

Verified Supplier
1 Years
Since 2006
Business Type :
Manufacturer, Seller
Total Annual :
1000000-16000000
Employee Number :
200~500
Certification Level :
Verified Supplier
Contact Supplier
Submit Requirement