TIF100-18-56U Ultra-soft thermal pad
The TIF™100-18-56U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 1.8W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> RoHS compliant
> UL recognized
Applications:
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
Typical Properties of TIF100-18-56U Series | ||
Property | Value | Test method |
Color | Green | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ****** |
Density | 2.3g/cm³ | ASTM D297 |
Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ****** |
Hardness | 27 Shore 00 | ASTM 2240 |
Continuos Use Temp | -40 to 160℃ | *** |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
Dielectric Constant | 3.7 MHz | ASTM D150 |
Volume Resistivity(Ohm-cm) | 4.0X10¹³ | ASTM D257 |
Fire rating | 94 V0 | UL E331100 |
Thermal conductivity | 1.8W/m-K | ASTM D5470 |
Outgassing(TML) | 0.55% | ASTM E595 |
Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)
Products Size:
8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.