TIG780-52 Hot Sale 5.2W High Quality Thermal Grease Cpu Gpu Graphics Card Conductivity Transistor Thermal Silicone Paste

The TIG™780-52 is environmentally safe silicone-based thermal grease designed to solve overheating and reliability issue.

TIG™780-52 is presenting thermal paste products. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipation efficiency is farsuperior to that offered by others.

Features

>Low thermal resistance
>Non-toxic and environmentally safe

>Excellent long term stability
>Thoroughly wets out contact surfaces to create low thermal resistance

Applications lnclude
>Display card
>Mainboard/mother board
>Notebook
>Power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
>Automotive electronics
>Set top boxes

>Cpu Gpu Graphics Card

Package
TIG™780-52 Series is available in 1kg (pint container), 3kg (quart container), and 10kg(gallon container).

Storage:
Store from 5°C to 25°C with a maximum humidity of 70%. Do not store in freezer or refrigerator below 10°C.

Company profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.