TIF100-20-02S High Thermal Conductive Pad For Automotive Silicon Thermal Pad
Product descriptions
TlF100-20-02S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features
> Good thermal conductive 2.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
Application
> Mainboard/mother board
> Notebook
> Power supply
> Micro heat pipe thermal solutions
> CPU
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> LED floor light
> Routers
> Medical Devices
Typical Properties of TIF100-20-02S Series | ||
Property | Value | Test method |
Color | Gray | ***** |
Construction &Compostion | Ceramic filled silicone elastomer | ***** |
Specific Gravity | 2.65g/cc | ASTM D297 |
Thickness range | 0.020"(0.50mm)~0.200"(5.0mm) | ASTM D374 |
Hardness | 45 Shore 00 | ASTM 2240 |
Continuos Use Temp | -45 to 200℃ | ***** |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
Dielectric Constant | 4.7MHz | ASTM D150 |
Volume Resistivity | 7.3X10¹³ Ohm-meter | ASTM D257 |
Flame rating | 94 V0 | UL E331100 |
Outgassing(TML) | 0.35% | ASTM E595 |
Thermal conductivity | 2.0W/m-K | ASTM D5470 |
Standard Thicknesses
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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