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Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive
Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive
Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive
Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive
Specifications
Brand Name :
Ziitek
Model Number :
TIS580-20
Certification :
UL and RoHs
Place of Origin :
Vietnam
MOQ :
10KG
Price :
0.1-10 USD/kg
Payment Terms :
T/T
Supply Ability :
10000KG/month
Delivery Time :
3-5 work days
Packaging Details :
1kg/can
Products name :
Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive
Material :
Silicone Adhesive
Thermal Conductivity :
2.0W/mk
Appearance :
White Paste
Hardness :
45（Shore A）
Keywords :
Thermally Conductive Silicone Glue
Total Cure Time :
3-7 Days (25℃)
Description

Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive

TIS™580-20 Series is dealcoholized, one component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.

TIS™580-20 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.

TIS™580-20 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive

Feature

> Good thermal conductivity: 2.0W/mK

> Good maneuverability and good adhesion

> Low shrinkage

> Low viscosity, leads to void-free surface

> Good solvent resistance, water resistance

> Longer working life

> Excellent thermal shock resistance

Application

It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-10, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective. E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
Typical values of TISTM580-20
Appearance White paste Test Method
Density(g/cm3,25℃) 1.6 ASTM D297
Tack-free time(min,25℃) ≤20 *****
Cure type(1-component) Dealcoholized *****
Viscosity@25℃ Brookfield (Uncured) 20K cps ASTM D1084
Total cure time(d, 25℃) 3-7 *****
Elongation(%) ≥200 ASTM D412
Hardness(Shore A) 45 ASTM D2240
Lap Shear Strength(MPa) ≥2.5 ASTM D1876
Peel Strength(N/mm) ＞5 ASTM D1876
Operation temperature(℃) -60～250 *****
Volume Resistivity(Ω·cm) 2.0×1016 ASTM D257
Dielectric Strength(KV/mm) 21 ASTM D149
Dielectric Constant (1.2MHz) 2.9 ASTM D150
Thermal Conductivity W/(m·K) 2.0 ASTM D5470
Flame Retardancy UL94 V-0 E331100

Package:
300ml/Tube, 24PCS/Box

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive

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Product Detail
Brand Name :
Ziitek
Model Number :
TIS580-20
Certification :
UL and RoHs
Place of Origin :
Vietnam
MOQ :
10KG
Price :
0.1-10 USD/kg
Contact Supplier
Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive
Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM

Verified Supplier
1 Years
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Thermal Pad, Thermal Grease, Phase Changing Materials
Total Annual :
1000000-16000000
Employee Number :
200~500
Certification Level :
Verified Supplier
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