TIF100 6520-11 High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad
Product descriptions
TIF®100 6520-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity, enabling efficient heat tansfer from discrete components or the entire PCB to the metal housing or heat sink ,This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.
Features:
> Excellent thermal conductivity 6.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
operties of TIF®100 6520-11 Series | ||
Color | Gray | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ****** |
Specific Gravity | 3.3g/cc | ASTM D297 |
thickness | 0.02"(0.50mm)~0.200"(5.00mm) | ASTM D374 |
Hardness (thickness<1.0mm) | 20(Shore 00) | ASTM 2240 |
Continuos Use Temp | -40 to 200℃ | ****** |
Dielectric Breakdown Voltage | ≥5000 VAC | ASTM D149 |
Dielectric Constant | 6.5MHz | ASTM D150 |
Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
Fire rating | 94 V0 | equivalent UL |
Thermal conductivity | 6.5W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.