TIF100C 5045-11 Good Heat Dissipation Thermal Pad Battery Thermal Pads For EV Batteries Protection
Product descriptions
TS-TIF®100C 5045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures, thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.
Features:
>Excellent thermal conductivity 5.0W/mK
>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating
>Available in varies thicknesses
>Broad range of hardnesses available
Applications:
>Cooling components to the chassis of frame
>High speed mass storage drives
>Heat Sinking Housing at LED-lit BLU in LCD
>LED TV and LED-lit lamps
>RDRAM memory modules
>Micro heat pipe thermal solutions
>Automotive engine control units
>Telecommunication hardware
>Handheld portable electronics
>Semiconductor automated test equipment (ATE)
>CPU
>Display card
>Mainboard/mother board
Typical Properties of TS-TIF®100C 5045-11 Series | ||
Color | Gray | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ****** |
Specific Gravity | 3.2g/cc | ASTM D297 |
thickness | 0.012"(0.30mm)~0.200"(5.00mm) | ASTM D374 |
Hardness (thickness<1.0mm) | 45 (Shore 00) | ASTM 2240 |
Continuos Use Temp | -45 to 200℃ | ****** |
Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
Dielectric Constant | 6.0MHz | ASTM D150 |
Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
Fire rating | 94 V0 | equivalent UL |
Thermal conductivity | 5.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Vietnam Ziitek Technology Company Limited. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.