TIR700-09 High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment

TS-TIR^®700-09 Series series is a high-performance carbon-based thermal pad that combines highly thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achievese xceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight design and mechanical flexibility, it is suitable for 5G equipment, high-performance chips, and other high heat flux applications.

Feature

> Good thermal conductivity 9.0W/mK

> Ultra-low thermal resistance
> Works under low pressure.

> Non-insulating material

> Non-adhesive surface

Application

> Between chips and heat dissipation modules

> 5G communication equipment
> Optoelectronics industry

> Wearable devices

Product Specification
Standard Thickness:0.04" (1.0mm), 0.06" (1.5mm),0.08" (2.0mm),0.10" (2.5mm),0.12" (3.0mm)

Standard Size: 1.97”x 1.97”(50.0mm x 50.0mm)

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.