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Copper Rotatable Sputtering Target High Density With Smooth Surface
Copper Rotatable Sputtering Target High Density With Smooth Surface
Copper Rotatable Sputtering Target High Density With Smooth Surface
Copper Rotatable Sputtering Target High Density With Smooth Surface
Copper Rotatable Sputtering Target High Density With Smooth Surface
Copper Rotatable Sputtering Target High Density With Smooth Surface
Specifications
Brand Name :
JINXING
Model Number :
Copper Rotatable Sputtering Target
Certification :
ISO 9001
Place of Origin :
China
MOQ :
1kg
Price :
15～100USD/kg
Payment Terms :
L/C, D/A, D/P, T/T, Western Union
Supply Ability :
100000kgs/M
Delivery Time :
10～25 work days
Packaging Details :
Plywood case
Material :
Copper
Process :
CIP, HIP Pressing
Size :
Customized
Application :
PVD Coating,
Density :
8.96g/cm3
Shape :
Round , Plate , Tube ,Rotatable Sputtering Target
Grain Size :
Fine Grain Size, Good density
Purity :
99.999%, 99.9999%
Description

Copper Rotatable Sputtering Target Ultra high purity 99.999%, 99.9999%

6N ultra-high purity electrolytic copper is mainly used in the production of sputtering target, evaporation film and anode materials for integrated circuits.

Purity: 99.999% ~ 99.9999%

For precise control of impurity content, Ag content can be controlled below 0.1ppm and s content below 0.02ppm

The content of gas elements (C, O, N, H) is less than 1ppm

Main uses: 6N copper has some properties similar to gold, good conductivity, ductility, corrosion resistance and surface performance, and low softening temperature. As a new kind of material, high-purity copper is not only used in the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets for liquid crystal display and ion coating, but also an indispensable and precious material in the atomic energy, rocket, missile, aviation, aerospace and metallurgical industries . As a new material, ultra pure copper has been paid more and more attention. In addition to the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets and ion coating for liquid crystal display, high-quality audio circuits and other high-tech fields, high-purity copper is also used in atomic energy, rockets, missiles, aviation, space navigation and other fields Precious materials are indispensable in metallurgical industry. With the development of high and new technology and the need of strategic materials, high-purity metals have higher and higher requirements for purity. The preparation and application of high-purity and ultra-high-purity metals in modern materials science and engineering are new and growing fields.

Among the production methods of high-purity copper, electrolytic refining technology is the most mature, widely used and the most promising method in industry. The key technology of electrolytic refining to produce high purity copper is to highly purify the electrolyte. The raw material is the cathode copper obtained by the general electrolytic plant. The purity of copper is improved by RE Electrolysis

Copper Rotatable Sputtering Target 99.9999% , Copper Tu beSputtering Target 99.9999% are available in varying sizes

Sizes:

Plate sputtering targets:

Thickness: 0.04 to 1.40" (1.0 to 35mm).

Width up to 20"(50 to 500mm).

Length: 3.9" to 6.56 feet( 100-2000mm)

other sizes as requested.

Cylinder sputtering targets:

3.94 Dia. x 1.58"(100 Dia. x 40mm)

2.56 Dia. x 1.58" (65 Dia. x 40mm)

or 63*32mm other sizes as requested.

Rotatable sputtering targets:

2.76 OD x 0.28 WT x 39.4”L (70 OD x 7 WT x 1000mm L)

3.46 OD x 0.39 WT x 48.4”L (88 OD x 10 WT x 1230mm L)

other sizes as requested.

Advantage:

1. Purity: 99.99% ~ 99.9999%

2. High density, no defects inside, even grains and smooth surface

3. Unique melting and casting pollution control process

4. It can meet the needs of customized alloy

5. Unique homogenization control technology of added elements

6. Unified microstructure control

Product Name Element Purirty Melting Point ℃ Density (g/cc) Available Shapes
High Pure Sliver Ag 4N-5N 961 10.49 Wire, Sheet, Particle, Target
High Pure Aluminum Al 4N-6N 660 2.7 Wire, Sheet, Particle, Target
High Pure Gold Au 4N-5N 1062 19.32 Wire, Sheet, Particle, Target
High Pure Bismuth Bi 5N-6N 271.4 9.79 Particle, Target
High Pure Cadmium Cd 5N-7N 321.1 8.65 Particle, Target
High Pure Cobalt Co 4N 1495 8.9 Particle, Target
High Pure Chromium Cr 3N-4N 1890 7.2 Particle, Target
High Pure Copper Cu 3N-6N 1083 8.92 Wire, Sheet, Particle, Target
High Pure Ferro Fe 3N-4N 1535 7.86 Particle, Target
High Pure Germanium Ge 5N-6N 937 5.35 Particle, Target
High Pure Indium In 5N-6N 157 7.3 Particle, Target
High Pure Magnesium Mg 4N 651 1.74 Wire, Particle, Target
High Pure Magnesium Mn 3N 1244 7.2 Wire, Particle, Target
High Pure Molybdenum Mo 4N 2617 10.22 Wire, Sheet, Particle, Target
High Pure Niobium Nb 4N 2468 8.55 Wire, Target
High Pure Nickel Ni 3N-5N 1453 8.9 Wire, Sheet, Particle, Target
High Pure Lead Pb 4N-6N 328 11.34 Particle, Target
High Pure Palladium Pd 3N-4N 1555 12.02 Wire, Sheet, Particle, Target
High Pure Platinum Pt 3N-4N 1774 21.5 Wire, Sheet, Particle, Target
High Pure Silicon Si 5N-7N 1410 2.42 Particle, Target
High Pure Tin Sn 5N-6N 232 7.75 Wire, Particle, Target
High Pure Tantalum Ta 4N 2996 16.6 Wire, Sheet, Particle, Target
High Pure Tellurium Te 4N-6N 425 6.25 Particle, Target
High Pure Titanium Ti 4N-5N 1675 4.5 Wire, Particle, Target
High Pure Tungsten W 3N5-4N 3410 19.3 Wire, Sheet, Particle, Target
High Pure Zinc Zn 4N-6N 419 7.14 Wire, Sheet, Particle, Target
High Pure Zirconium Zr 4N 1477 6.4 Wire, Sheet, Particle, Target

Copper Rotatable Sputtering Target High Density With Smooth Surface

Product tags

sputtering deposition

,

sputter deposition

,

sputtering thin film deposition
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Copper Rotatable Sputtering Target High Density With Smooth Surface

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Product Detail
Brand Name :
JINXING
Model Number :
Copper Rotatable Sputtering Target
Certification :
ISO 9001
Place of Origin :
China
MOQ :
1kg
Price :
15～100USD/kg
Contact Supplier
Copper Rotatable Sputtering Target High Density With Smooth Surface
Copper Rotatable Sputtering Target High Density With Smooth Surface
Copper Rotatable Sputtering Target High Density With Smooth Surface

JINXING MATECH CO LTD

Site Member
6 Years
Since 2007
Business Type :
Manufacturer, Distributor/Wholesaler, Importer, Exporter, Seller, Other
Main Products :
Zirconium Bar, Tungsten Copper Alloy, Tungsten Heavy Alloy
Total Annual :
5,000,000-10,000,000
Employee Number :
10~25
Certification Level :
Site Member
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