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Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Specifications
Brand Name :
JINXING
Model Number :
Molybdenum Copper Alloy
Certification :
ISO 9001
Place of Origin :
China
MOQ :
1kg
Price :
30~150USD/kg
Payment Terms :
L/C, D/A, D/P, T/T, Western Union
Supply Ability :
10000kgs/M
Delivery Time :
10~25 work days
Packaging Details :
Plywood Case
Material :
Molybdenum Copper Alloy
Standard :
ASTM, AMS
Size :
Customized
Type :
MoCu15~MoCu50
Surface :
Mirror bright
Density :
9.54~10g/cm3
Description

Molybdenum Copper Plate Mo60Cu40 / Mo70Cu30 / Mo80Cu20 heat sink sealing

Molybdenum Copper Plates can be processed with the content (Mo85Cu15 , Mo80Cu20 , Mo70Cu30 , Mo60Cu40 , Mo50Cu50) MoCu 85/15 Molybdenum-Copper Composite Material , MoCu 70/30 Molybdenum-Copper Composite Material , MoCu 65/35 Molybdenum-Copper Composite Material , Molybdenum-Copper Composite AMC 7525

Description

Molybdenum Copper Plate is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy sheets for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy plate

Type Mo Wt% Cu Wt% g/cm3 W/(M.K)
(10-6/K)
Mo85Cu15 85± 1 Balance 10 160 - 180 6.8
Mo80Cu20 801 Balance 9.9 170 - 190 7.7
Mo70Cu30 701 Balance 9.8 180 - 200 9.1
Mo60Cu40 601 Balance 9.66 210 - 250 10.3
Mo50Cu50 50 ±0.2 Balance 9.54 230 - 270 11.5
Material Notes: Characteristics:
  • High thermal conductivity
  • Low thermal expansion
  • Low density
Applications:
  • Electronic components - passive cooling elements
  • Automotive industry - carrier plates for IGBT modules in electric drives

Related

  • Molybdenum Copper Wafer substrate

  • Molybdenum Copper Heat sink

  • Molybdenum Copper Rod

Low Density Molybdenum Copper Alloy Plate For Electronic Components

Product tags

tungsten copper plate alloy

,

aluminum diamond plate sheet metal

,

tzm molybdenum alloy plates
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Low Density Molybdenum Copper Alloy Plate For Electronic Components

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Product Detail
Brand Name :
JINXING
Model Number :
Molybdenum Copper Alloy
Certification :
ISO 9001
Place of Origin :
China
MOQ :
1kg
Price :
30~150USD/kg
Contact Supplier
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components

JINXING MATECH CO LTD

Site Member
6 Years
Since 2007
Business Type :
Manufacturer, Distributor/Wholesaler, Importer, Exporter, Seller, Other
Main Products :
Zirconium Bar, Tungsten Copper Alloy, Tungsten Heavy Alloy
Total Annual :
5,000,000-10,000,000
Employee Number :
10~25
Certification Level :
Site Member
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