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Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Specifications
Brand Name :
JINXING
Model Number :
Molybdenum Copper Wafer substrate
Certification :
ISO 9001
Place of Origin :
China
MOQ :
1kg
Price :
30~150USD/kg
Payment Terms :
L/C, D/A, D/P, T/T, Western Union
Delivery Time :
25 work days
Packaging Details :
Plywood Case
Supply Ability :
1000kgs/M
Material :
Molybdenum Copper Alloy
Standard :
ASTM, AMS
Surface :
Mirror bright
Size :
Customized
Min THK :
0.05mm
Type :
MoCu15~MoCu50
Description

Molybdenum Copper Wafer substrate for LED chips Diameter 25.4mm / 1.0 inch

Wafer substrate made of molybdenum, molybdenum copper and tungsten copper materials: In order to make the LED lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life.

Description

Nickel-plated gold-plated molybdenum-copper substrate microelectronic electronic sealing sheet

Copper-molybdenum-copper alloy heat sink material is a composite material of tungsten and copper. It has both low expansion characteristics of tungsten and high thermal conductivity of copper. Especially valuable, its thermal expansion coefficient and thermal conductivity can be adjusted by adjusting the material. The composition of the composition (in terms of terms, its performance is tailorable), thus bringing great convenience to the application of the material. The copper-molybdenum-copper alloy heat sink material produced by our company can form a good thermal expansion match with the following materials:

Ceramic materials Al2O3 (A-90, A-95, A-99), BeO (B-95, B-99), AlN, etc.
Semiconductor materials Si, GaAs, SiGe, SiC, InGaP, InGaAs, InAlGaAs, AlGaInP, and AlGaAs
Metal materials Kovar alloy (4J29), 42 alloy, etc

The characteristics and performance of our company's copper-molybdenum-copper (Cu/Mo/Cu) alloy heat sink material:

Copper-molybdenum-copper (Cu/Mo/Cu) is a sandwich structure consisting of two sub-layers - copper (Cu) - a core layer - molybdenum (Mo), which has an adjustable coefficient of thermal expansion, high thermal conductivity and its high The characteristics of strength.

1. Copper-molybdenum-copper (Cu/Mo/Cu) alloy heat sink material Features:

High thermal conductivity can be maintained without adding sintering and activation elements such as Fe and Co

Can provide semi-finished products or finished products with Ni/Au plating on the surface

Copper Molybdenum Products Wafer Substrate With High Thermal ConductivityCopper Molybdenum Products Wafer Substrate With High Thermal Conductivity

Product tags

ceramic multilayer pcb

,

multilayer ceramic pcb

,

beryllium copper thermal conductivity
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Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity

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Product Detail
Brand Name :
JINXING
Model Number :
Molybdenum Copper Wafer substrate
Certification :
ISO 9001
Place of Origin :
China
MOQ :
1kg
Price :
30~150USD/kg
Contact Supplier
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity

JINXING MATECH CO LTD

Site Member
6 Years
Since 2007
Business Type :
Manufacturer, Distributor/Wholesaler, Importer, Exporter, Seller, Other
Main Products :
Zirconium Bar, Tungsten Copper Alloy, Tungsten Heavy Alloy
Total Annual :
5,000,000-10,000,000
Employee Number :
10~25
Certification Level :
Site Member
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