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Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
Specifications
Brand Name :
Laird
Model Number :
A182XX-XX
Certification :
ROHS,SGS,ISO
Place of Origin :
China
MOQ :
1000pcs
Price :
Customize
Payment Terms :
T/T
Delivery Time :
1-3 weeks
Packaging Details :
Reel, Tray
Construction & Composition :
Ceramic filled silicone free thermoplastic N/A
Color :
Grey
Thickness Range :
0.5mm – 4mm (+/- 10%)
Thermal Conductivity :
10 W/mk
Density :
3.7 g/cc
Hardness Shore 00 (3 second) :
41 (1mm-4mm) 70 (0.5mm – 0.75mm)
Volume Resistivity (Ω cm) :
10^14
Lead Free :
Yes
ROHS Compliant :
Yes
Outgassing (TML%) :
0.33
Description

Thermal Pad Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk

Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad

Product Description

Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance.

Features and Benefits

  • Silicone free formulation
  • Low Shore Hardness
  • Low pressure versus deflection
  • Minimizes board and component stress
  • No fiberglass reinforcement
  • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH

Industries

  1. Automotive
  2. Consumer
  3. Industrial
  4. Telecom/Datacom
  5. Aerospace/Defense

Applications

  1. Automotive Electronics
  2. Automotive ADAS
  3. Automotive Powertrain/ECUs
  4. Automotive Infotainment
  5. Routers
  6. Hard Disk Drives
  7. Solid State Drives
  8. Wireless infrastructure
  9. Drones/Satellites
  10. Gaming Systems
  11. Smart Home Devices
  12. Notebooks/Tablets/Portable Devices

Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad

About Us: ZSUN TECH

Brand Advantage:

ZSUN consists of a professional team with an average of over 10 year of expertise in the field of electronic components.

An advanced enterprise specializing in the research, development, production, and sales of EMC components, connectors, cables, and integrated circuits (ICs).

Professional EMC products and services, including EMC component selection, EMC simulation, EMC training, and EMC corrective testing services.

ZSUN is a senior enterprise specializing in the research and development, production and sales of EMC components, connectors, cables and Integrated Circuits (ICs). Its headquarter is located in Shenzhen. It consists of a professional team with an average of over 10 year of expertise in the field of electronic components.

The main products include: high current power inductors, Moding power choke, NR inductors, SMD power inductors, DIP inductors, Rod inductors, DC& signal common mode choke, AC common mode choke, transformers , Board-to-board connectors, wire-to-board connectors, communication interfaces, terminals, European connectors, crimp terminals and high-speed connectors, etc., are widely used in industrial control, automotive electronics, medical electronics, new energy motors, communication equipment , digital power amplifier, financial electronics, power system, cables, Integrated Circuits (ICs) and other fields.

ZSUN is committed to build a one-stop electronic components supply platform, allowing customers to enjoy the most professional EMC products and services, namely EMC components selection, EMC simulation, EMC training and EMC rectification &testing services. With advanced management system, strong development capabilities and excellent products Quality and perfect service, ZSUN has become a supplier of electronic components for many well-known enterprises at home and abroad.

Contact Us:

Sales Manager: Rose

Email: Rose@zsun-chips.com

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Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad

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Product Detail
Brand Name :
Laird
Model Number :
A182XX-XX
Certification :
ROHS,SGS,ISO
Place of Origin :
China
MOQ :
1000pcs
Price :
Customize
Contact Supplier
Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad

ZSUN CHIPS CO., LTD

Verified Supplier
2 Years
guangdong, shenzhen
Since 2021
Business Type :
Distributor/Wholesaler, Agent, Exporter, Trading Company, Seller
Main Products :
Power Inductors, Thermal Interface Materials, FPGA IC
Total Annual :
500,000-1,000,000
Employee Number :
50~80
Certification Level :
Verified Supplier
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